PURPOSE: To improve the throughput of a single wafer semiconductor manufacturing equipment while restraining the equipment cost, which is equipped with the atmosphere side load lock chamber delivering wafers to a carrier cassette in the atmosphere and a reaction chamber side load lock chamber including a vacuum transfer robbot.

CONSTITUTION: The title equipment is constituted by using the atmosphere side load lock chamber 101 accommodating a wafer stage on which wafers before and after treatment are mounted, and a first and a second load lock chambers which include the respective vacuum transfer robbots 5. The wafers circulate in the order through the atmosphere side load lock chamber, the first load lock chamber, a reaction chamber, the second load lock chamber and the atmosphere side load lock chamber. The wafers before treatment can always be kept waiting in the first load lock chamber. Time necessary to evacuate the inside of the atmosphere side load lock chamber as required in the conventional case, in order to take out the wafers from the atmosphere side load lock chamber can be prevented from being added to the processing time in the reaction chamber.