Title:
SEMICONDUCTOR MANUFACTURING EQUIPMENT
Document Type and Number:
Japanese Patent JPH06151481
Kind Code:
A
Abstract:
PURPOSE: To obtain a semiconductor manufacturing equipment which can prevent the disconnection and insufficient contact of fine wiring mounted on the surface of a semiconductor element by reducing the impact load given by the collet to the surface of the semiconductor element when the semiconductor element is attracted to the collet by suction.
CONSTITUTION: A gas is blown out against the surface of a semiconductor element 3 from the suction hole 2 of a collet 1 until the collet 1 comes into contact with the surface of the element 3 after the lowering of the collet 1 is started from a fixed lowered position H1 so as to reduce the impact load given by the collet to the surface of the element 3.
Inventors:
OZEKI YUKIO
MASUDA HISAO
MAKINO HIROTA
MASUDA HISAO
MAKINO HIROTA
Application Number:
JP18643292A
Publication Date:
May 31, 1994
Filing Date:
July 14, 1992
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/52; H01L21/677; H01L21/68; (IPC1-7): H01L21/52; H01L21/68
Attorney, Agent or Firm:
Takada Mamoru