To simultaneously inspect a semiconductor wafer, while performing a semiconductor manufacturing process with respect to the semiconductor wafer.

A plurality of semiconductor wafer as a unit are installed in a semiconductor manufacturing apparatus 1, each semiconductor wafer being subjected to a semiconductor manufacturing process, and any one of the semiconductor wafers after subjected to the semiconductor manufacturing process is externally extracted from a position 5 different from a position 3 at which the plural wafers were installed in the apparatus 1, and the extracted semiconductor wafer is inspected. When the wafer is decided as being acceptable, the wafer is again returned into the apparatus 1 from the position 5 different from the position 3, and returned wafer is returned to the position 3, together with the other semiconductor wafers by plural number, after completion subjected to the semiconductor manufacturing process.