To provide a semiconductor package which enables stacking without requirement of complicated electrical connections and also to provide a package stack semiconductor device in which a plurality of semiconductor packages are stacked.
In the semiconductor package, a plurality of semiconductor elements are stacked with the die-bonding method on a base wiring substrate provided with an external connection terminal at the lower surface, a wiring substrate for extension provided with an external connection terminal at the upper surface is further stacked with the die-bonding method on the semiconductor element at the upper most stage, and each of semiconductor element and wiring substrate for extension is connected on the surface of the base wiring substrate with the wire-bonding method and is sealed with resin to expose the external connection terminal of the wiring substrate for extension. In the package stack semiconductor device, a plurality of semiconductor packages are stacked, and the external connection terminal at the upper surface exposed from the resin seal of the semiconductor package of the lower stage and the external connection terminal at the lower surface of the base wiring substrate of the semiconductor package of the upper stage are joined with the solder to electrically connect the upper and lower semiconductor packages.
Masaya Nishiyama
Higuchi Souji