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Title:
半導体物理量センサ
Document Type and Number:
Japanese Patent JP4892781
Kind Code:
B2
Abstract:
An inexpensive, accurate, and reliable semiconductor physical quantity sensor having improved resistance to noise is provided, wherein pads that have been pulled down to ground inside a semiconductor chip are arranged closer to a ground pad, while pads and that have been pulled up to a power supply inside the chip are arranged closer to a power supply pad. Of the digital input/output pads that have undergone digital trimming to obtain a predetermined output, the pulled-down pads and the ground pad are electrically connected to a ground terminal outside the chip via internal exposed portions, wires, and a ground-connecting external wire. The pulled-up pads and the power supply pad are electrically connected to a power supply terminal outside the chip via the internal exposed portions, the wires, and a power-supply-connecting external wire. Terminals may be electrically connected together on a package or a mounting substrate.

Inventors:
Kamimichi Kamiyanagi
Kazunori Saito
Hitoshi Ashino
Mutsuo Nishikawa
Katsuyuki Uematsu
Application Number:
JP2001010772A
Publication Date:
March 07, 2012
Filing Date:
January 18, 2001
Export Citation:
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Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L29/84; G01L9/00; G01L9/04; G01P1/02; G01P15/08; G01P15/12
Domestic Patent References:
JP64039565A
JP10206170A
JP10170368A
JP5095099A
JP1094646A
JP10096743A
JP1220467A
JP3051714A
JP57169644A
JP2000105163A
JP10148642A
JP5322922A
Attorney, Agent or Firm:
Atsuhiro Hamanaka
Katsumoto Ryuji
Yoshikazu Tani
Kazuo Abe



 
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