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Patent Searching and Data


Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JPH07120337
Kind Code:
A
Abstract:

PURPOSE: To greatly improve the assembling efficiency of a pressure sensor by fitting a pressure sensor element to a holder, further fitting the holder to a stem, inserting a spring into the holder and setting a circuit board thereover.

CONSTITUTION: A lead pin 25 of the pressure sensor element 21 is bent in the horizontal direction to be positioned in a groove formed in a holder 26. A retaining member 30 is covered over the holder 26 to fix the element 21. At the same time, a conductive spring 34 to be connected with the pin 25 is inserted into a spring insertion hole of the member 30. Moreover, the spring 34 and a circuit board 41 are set on the member 30. The pin 25 of the element 21 is, accordingly, electrically connected with a circuit pattern of the board 41 via the spring 34. Since the circuit pattern on the upper surface of the board 41 is also connected with an external connecting terminal 39 set in a case 38, the pin 25 of the element 21 is connected with the circuit board 41 and terminal 39 without soldering, thereby a working efficiency is improved.


Inventors:
KAWAKAMI TAKAHIRO
Application Number:
JP27077693A
Publication Date:
May 12, 1995
Filing Date:
October 28, 1993
Export Citation:
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Assignee:
KANSEI KK
International Classes:
G01L9/04; G01L9/00; G01L19/00; (IPC1-7): G01L9/04; G01L19/00
Attorney, Agent or Firm:
Honda Kodaira (3 outside)