Title:
高周波モジュール及び高周波モジュールの製造方法
Document Type and Number:
Japanese Patent JP7120336
Kind Code:
B2
Abstract:
A high-frequency module including a transmission line for a high-frequency signal and a waveguide conversion structure, capable of reducing the size thereof, and a method for manufacturing such a high-frequency module are provided. A high-frequency module includes a core material in which a first dielectric layer is provided between a first conductive layer and a second conductive layer, a laminated filter in which a plurality of core materials and dielectric layers are alternately laminated, and a through hole pierces therethrough from a lowermost conductive layer provided so as to be in contact with the lowermost dielectric layer to the uppermost first conductive layer, a first surface dielectric layer provided above the laminated filter, and a first surface conductive layer provided above the first surface dielectric layer, the first surface conductive layer including a transmission line for a high-frequency signal and a ground GND.
Inventors:
Takashi Ohkawa
Application Number:
JP2020572121A
Publication Date:
August 17, 2022
Filing Date:
January 09, 2020
Export Citation:
Assignee:
NEC
International Classes:
H01P5/107; H01P5/18; H01P11/00
Domestic Patent References:
| JP2015146544A | ||||
| JP11243307A | ||||
| JP2013247495A |
Foreign References:
| US3845422 |
Other References:
板倉 清保(外1名),「現代電気工学講座 超高周波回路」,オーム社,1963年02月25日,pp.206-210
Attorney, Agent or Firm:
Ken Ieiri
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