Title:
SEMICONDUCTOR SUBSTRATE HEAT TREATING APPARATUS
Document Type and Number:
Japanese Patent JP2002110582
Kind Code:
A
Abstract:
To provide a semiconductor substrate heat treating apparatus which realizes a high accuracy temperature measurement.
The treating apparatus having a halogen lamp 14 for heating and heat treating a mounted semiconductor substrate 3 and a radiation thermometer 11 having a quartz rod 7 which takes in lights radiated from the substrate 3 heated with lights from the lamp 14, thereby measuring the temperature of the substrate 3, comprises a hollow 17 formed around the outside of the quartz rod 7 for absorbing lights.
Inventors:
RI KAZUNARI
SHIGEOKA TAKASHI
SAKUMA TAKESHI
SHIGEOKA TAKASHI
SAKUMA TAKESHI
Application Number:
JP2000293023A
Publication Date:
April 12, 2002
Filing Date:
September 26, 2000
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H05B3/00; C23C16/46; G01J5/00; G01J5/02; H01L21/205; H01L21/26; (IPC1-7): H01L21/26; C23C16/46; H01L21/205; H05B3/00
Domestic Patent References:
| JPH1197367A | 1999-04-09 | |||
| JPH1197368A | 1999-04-09 | |||
| JPH1140510A | 1999-02-12 | |||
| JPH1055974A | 1998-02-24 |
Attorney, Agent or Firm:
Tadahiko Ito