Title:
SEMICONDUCTOR WAFER HEATING/COOLING DEVICE
Document Type and Number:
Japanese Patent JP2001267403
Kind Code:
A
Abstract:
To heat or cool a semiconductor wafer efficiently and make in-plane temperature distribution uniform.
This device is equipped with a vacuum chuck 10 having a chuck surface 12 on which a semiconductor wafer W is sucked on one surface, a flange 20 stacked on the surface opposite to the vacuum chuck 10 with a heat transfer sheet 30 having elasticity between the vacuum chuck and the flange and having an electric heater 40 and a coolant passage 50 inside and an inlet pipe 60A opening in the chuck surface 12 and penetrating through the heat transfer sheet 30 and the flange 20.
Inventors:
HANAMACHI TOSHIHIKO
KAYAMOTO TAKASHI
KAYAMOTO TAKASHI
Application Number:
JP2000078207A
Publication Date:
September 28, 2001
Filing Date:
March 21, 2000
Export Citation:
Assignee:
NHK SPRING CO LTD
International Classes:
H01L21/66; H01L21/205; H01L21/68; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Mikio Suenari
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