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Title:
SEMICONDUCTOR WAFER PROVIDED WITH DISCRIMINATION CODE AND ENTERING METHOD FOR DISCRIMINATION CODE
Document Type and Number:
Japanese Patent JPH0697013
Kind Code:
A
Abstract:

PURPOSE: To easily discriminate a semiconductor wafer by the visual check of an operator by a method wherein a character-string discrimination code indicated by a character string and a character-string-corresponding discrimination encoded code corresponding to the character-string discrimination code are formed side by side on the semiconductor wafer.

CONSTITUTION: Character-string discrimination code 4 indicated by a character string such as an alphanumeric character or the like and a character-string- corresponding discrimination encoded code 5 corresponding to the character- string discrimination code are formed in an orientation flat part 3 outside a semiconductor-element pattern region 2 on a semiconductor wafer 1. The character-string discrimination code 4 is composed of a character string indicating the type name, the throwing-in time and the lot name of the semiconductor wafer by means of an alphanumeric character or the like. On the other hand, the character-string-corresponding discrimination encoded code 5 corresponding to the character string is composed of a character-string-corresponding discrimination binary code which can be read out automatically by an automatic discrimination-code reaction deice.


Inventors:
AMADA HARUO
YAMAMOTO KEIZO
HORIMIZU OSAMU
TANAKA KENSUKE
Application Number:
JP24764292A
Publication Date:
April 08, 1994
Filing Date:
September 17, 1992
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/02; (IPC1-7): H01L21/02
Attorney, Agent or Firm:
Akita Aki



 
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