Title:
SEMICONDUCTOR WAFER SUPPLIER
Document Type and Number:
Japanese Patent JPS6072241
Kind Code:
A
Abstract:
PURPOSE:To simplify the construction of the automation line for wafer sampling inspection or processing by a method wherein wafers in a container for general purpose are taken out of a desired position, and then contained to the original position after processing. CONSTITUTION:A thrust-up mechanism 7 and a chuck 8 are placed at the position of the origin by means of an origin positioning device C and a constant pitch feed mechanism 4 under the control of a transfer control device B. The mechanism 7 and the chuck 8 are moved 4 to the position of a desired wafer, the wafer 2 being pushed up and then chucked 8, the state being then confirmed 10; thereafter they are reset to the position of the origin. The mechanism 7 moves up and down, feeds the wafer mounted on the tip to an inversion device 9, lays it horizontally, and carries it to a processing device 13. After processing, the wafer is replaced to the original position of the container 1 through the reverse order. Desired wafers in the container can be supplied and housed by repetition of this action.
Inventors:
OOTANI MASAKI
Application Number:
JP18186883A
Publication Date:
April 24, 1985
Filing Date:
September 28, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B65G47/248; B65G1/00; H01L21/67; H01L21/677; H01L21/68; (IPC1-7): B65G47/22
Domestic Patent References:
| JPS5599739A | 1980-07-30 | |||
| JPS56120124A | 1981-09-21 |
Attorney, Agent or Firm:
Masuo Oiwa