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Title:
センサ装置およびその製造方法
Document Type and Number:
Japanese Patent JP4337570
Kind Code:
B2
Abstract:
A sensor device (S1) includes a sensor chip (20) and a bonding wire (40) being fixed on a substrate (10). The sensor device (S1) is manufactured by using a binding material (30) made of an adhesive (32) containing a foaming agent (31 a) that evaporates upon exposure to heat. The binding material (30) reduces its elasticity after a wire bonding process because voids (31) being functional as a cushion are formed by evaporation of the foaming agent (31a).

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Inventors:
Takashige Saito
Application Number:
JP2004033087A
Publication Date:
September 30, 2009
Filing Date:
February 10, 2004
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
G01P15/125; H01L21/50; G01D11/24; G01P1/02; G01P15/08; H01L21/58; H01L23/48; H01L29/84
Domestic Patent References:
JP9120968A
JP2002076191A
JP53119673A
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno



 
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