To provide a method for manufacturing a sensor device capable of improving yield of a bonding process for bonding a sensor substrate having a thermal type infrared radiation detection section formed thereon with a package substrate and preventing a drawing wire for electrically connecting the thermal type infrared radiation detection section to a metallic layer for electric connection on the sensor substrate from being broken, and to provide the sensor device.
In the sensor substrate 1, a step is formed between a first region where the thermal infrared radiation detection section 13 is formed and a second region where a first metallic layer 19 for electric connection and a first metallic layer 18 for sealing are formed on an insulation layer of a first semiconductor substrate 10 at a main surface side. A film thickness of a drawing wire 16 formed along the surface of the insulation layer so as to electrically connect the thermal infrared radiation detection section 13 to the first metallic layer 19 for electric connection and film thicknesses of the first metallic layer 18 for sealing and the first metallic layer 19 for electric connection are independently set.
COPYRIGHT: (C)2009,JPO&INPIT
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Takeshi Yoshi
Koji Tsuji
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