Title:
SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2020126784
Kind Code:
A
Abstract:
To reduce cost by downsizing a sensor device.SOLUTION: A sensor device 1 comprises: a substrate on which a sensor is mounted; and a device body 1a to which the substrate is assembled. The device body 1a has: a main body 10 to which the substrate is fitted; and a cover 20 which covers the substrate from above. The main body 10 has: an outer peripheral wall 12 which surrounds the outer periphery of the substrate; and a spring fixing part 11 to which a mounting spring 40 for installing the device body 1a on a ceiling is fitted. The spring fixing part 11 protrudes upward. The cover 20 has an opening which vertically penetrates the cover 20. The substrate has a terminal block 32 mounted thereon which is provided with a terminal electrically connectable to an external device. The terminal block 32 protrudes upward from the opening. An upper end of the terminal block 32 is located below an upper end of the spring fixing part 11.SELECTED DRAWING: Figure 3
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Inventors:
OMORI AKIHIRO
MATSUDA SEIJI
MATSUDA SEIJI
Application Number:
JP2019018937A
Publication Date:
August 20, 2020
Filing Date:
February 05, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01H35/00; G01D11/30
Domestic Patent References:
| JPH03194821A | 1991-08-26 | |||
| JP2008004363A | 2008-01-10 | |||
| JP2019012683A | 2019-01-24 | |||
| JP2010287400A | 2010-12-24 |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Jiro Ozawa
Hideki Takahashi
Jiro Ozawa