Title:
SHAPE MEASUREMENT METHOD, SHAPE MEASUREMENT DEVICE, AND PROGRAM
Document Type and Number:
Japanese Patent JP2023012227
Kind Code:
A
Abstract:
To measure the shape of a cyclically arranged pattern with high accuracy.SOLUTION: With a shape measurement method according to an embodiment, the convergence value of parameters included in a first parameter group is computed by a first fitting process using a scattering intensity profile pertaining to the scattering intensity of an electromagnetic wave with which a substrate having a prescribed pattern is irradiated, and a first predicted scattering intensity profile pertaining to scattering intensity computed by a first simulation on a first virtual structure composed on the basis of the first parameter group consisting of a plurality of parameters including a parameter of interest. The convergence value of parameters included in a second parameter group is computed by a second fitting process using the scattering intensity profile and a second predicted scattering intensity profile pertaining to scattering intensity which is computed by a second simulation on a second virtual structure composed on the basis of a second parameter group consisting of a plurality of parameters including a parameter of interest, and in which the convergence value is set as a constant to the parameter of interest.SELECTED DRAWING: Figure 4
Inventors:
HAGIWARA KAZUKI
Application Number:
JP2021115748A
Publication Date:
January 25, 2023
Filing Date:
July 13, 2021
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
G01B15/04
Attorney, Agent or Firm:
Sakai International Patent Office