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Title:
SHEET APPLICATION APPARATUS AND SHEET APPLICATION METHOD
Document Type and Number:
Japanese Patent JP2013038256
Kind Code:
A
Abstract:

To provide a sheet application apparatus which properly records new information and applies an adhesive sheet, enabling easy cost reduction and disposal, to a wafer, and to provide a sheet application method of the sheet application apparatus.

A sheet application apparatus 1 comprises: feeding means 10 feeding an original fabric R1 where an original adhesive sheet S0 having an adhesive layer AD on one surface of a base material sheet BS is temporarily attached to one surface of a belt-like peeling sheet RL through the adhesive layer AD; laminating means 30 which laminates a magnetic recording layer ML capable of recording predetermined information, on the original adhesive sheet S0 to form an adhesive sheet S1; a peeling plate 70 peeling the adhesive sheet S1 from the peeling sheet RL; and a pressurizing roller 81 pressing the adhesive sheet S1 peeled by the peeling plate 70, against a wafer W to apply the adhesive sheet S1 thereto.


Inventors:
SUGISHITA YOSHIAKI
Application Number:
JP2011173836A
Publication Date:
February 21, 2013
Filing Date:
August 09, 2011
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
H01L21/683
Domestic Patent References:
JP2008293508A2008-12-04
JP2010073954A2010-04-02
JP2005310889A2005-11-04
JPH0269958A1990-03-08
JP2008293508A2008-12-04
Foreign References:
EP1873812A12008-01-02
EP1873812A12008-01-02
Attorney, Agent or Firm:
Intellectual Property Office