Title:
SHEET FOR PROCESSING OF PLATE LIKE MEMBER AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2013038255
Kind Code:
A
Abstract:
To provide a sheet for wafer processing which easily reduces the costs and enables easy disposal, and to provide a manufacturing method of the sheet for the wafer processing.
An adhesive sheet S1 is applied to a wafer W and a ring frame RF and thereby causing the ring frame RF to hold the wafer W. The adhesive sheet S1 includes: a base material sheet BS; a magnetic recording layer ML laminated on one surface of the base material sheet BS and recording predetermined information; and an adhesive layer AD laminated on the base material sheet BS so as to cover the magnetic recording layer ML.
Inventors:
SUGISHITA YOSHIAKI
Application Number:
JP2011173835A
Publication Date:
February 21, 2013
Filing Date:
August 09, 2011
Export Citation:
Assignee:
LINTEC CORP
International Classes:
H01L21/683; C09J7/02; H01L21/301
Domestic Patent References:
| JP2005310889A | 2005-11-04 | |||
| JPH08318952A | 1996-12-03 |
Foreign References:
| EP1873812A1 | 2008-01-02 | |||
| EP1873812A1 | 2008-01-02 |
Attorney, Agent or Firm:
Intellectual Property Office