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Title:
OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION SHEET
Document Type and Number:
Japanese Patent JP2023164766
Kind Code:
A
Abstract:
To provide an optical semiconductor element encapsulation sheet excellent in light diffusivity while excellent in light extraction efficiency.SOLUTION: An optical semiconductor element encapsulation sheet 1 is a sheet for encapsulating one or more optical semiconductor elements 6 arranged on a substrate 5, and includes an encapsulation part 2 having a light diffusion layer and an antireflection layer. In the optical semiconductor element encapsulation sheet 1, in a state where a functional layer is laminated on one side of the sheet 1, values of L*1, a*1 and b*1 at L*a*b*(SCE) when measured from the functional layer side and L*2, a*2 and b*2 at L*a*b*(SCE) when measured from the sheet 1 side satisfy expressions (1) to (3), respectively: -5

Inventors:
ASAI KAZUKO
NAKANO TAKESHI
FUKUTOMI SHUHEI
TANAKA SHUNPEI
UENO TAIKI
NAGATSUKA NAOKI
Application Number:
JP2023137996A
Publication Date:
November 13, 2023
Filing Date:
August 28, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01L33/54; B32B7/023; C09K3/10; G09F9/00; G09F9/30; G09F9/33; H01L33/56; H01L33/58
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical