Title:
OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION SHEET
Document Type and Number:
Japanese Patent JP2023164767
Kind Code:
A
Abstract:
To provide an optical semiconductor element encapsulation sheet excellent in designability in a state where an optical semiconductor element is encapsulated while capable of making luminance unevenness hard to occur.SOLUTION: An optical semiconductor element encapsulation sheet 1 is a sheet for encapsulating one or more optical semiconductor elements 6 arranged on a substrate 5. The optical semiconductor element encapsulation sheet 1 includes: a first encapsulation layer 21 abutting on the optical semiconductor element 6; a second encapsulation layer 22 laminated on the first encapsulation layer 21; and a third encapsulation layer 23 having tackiness and/or adhesiveness, laminated on the second encapsulation layer 22. The second encapsulation layer 22 and/or the third encapsulation layer 23 include(s) a coloring agent. One or more selected from a group consisting of the first encapsulation layer 21, the second encapsulation layer 22 and the third encapsulation layer 23 is/are a diffusion functional layer.SELECTED DRAWING: Figure 1
Inventors:
TANAKA SHUNPEI
UENO TAIKI
NAGATSUKA NAOKI
NAKANO TAKESHI
ASAI KAZUKO
FUKUTOMI SHUHEI
UENO TAIKI
NAGATSUKA NAOKI
NAKANO TAKESHI
ASAI KAZUKO
FUKUTOMI SHUHEI
Application Number:
JP2023138143A
Publication Date:
November 13, 2023
Filing Date:
August 28, 2023
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L33/54; B32B7/023; G09F9/00; G09F9/30; G09F9/33; H01L33/56; H01L33/58
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical