Title:
REACTIVE HOT-MELT ADHESIVE COMPOSITION WITH IMPACT RESISTANCE
Document Type and Number:
Japanese Patent JP2017222776
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a solventless-type and one-pack type reactive hot-melt adhesive composition that has application properties enabling adhesion between parts in an extremely small portion and also has impact resistance.SOLUTION: The reactive hot-melt adhesive composition contains a urethane prepolymer (i) having an isocyanate group, obtained by allowing a polyester polyol (A), a polyether polyol (B), and an isocyanate (C) to react with each other, and a component (ii) nonreactive with the urethane prepolymer (i). In the reactive hot-melt adhesive composition, the mechanical characteristics of an obtained adhesive layer are a tensile elasticity of 40 MPa or less, defined in JIS K-7127, a tensile fracture stress of 15 MPa or more, and a breaking point elongation of 1000% or more.SELECTED DRAWING: None
Inventors:
KOMIYA SOICHIRO
KURAMOCHI CHIKA
SUZUMURA KOJI
MAGOME KAZUYUKI
KURAMOCHI CHIKA
SUZUMURA KOJI
MAGOME KAZUYUKI
Application Number:
JP2016118873A
Publication Date:
December 21, 2017
Filing Date:
June 15, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J175/06; C08G18/12; C08G18/40; C09J11/06; C09J175/08
Domestic Patent References:
| JP2007091996A | 2007-04-12 |
Foreign References:
| WO2013153907A1 | 2013-10-17 | |||
| WO2011033992A1 | 2011-03-24 |