Title:
SILICA FILM-FORMING COMPOSITION, SILICA FILM, ITS FORMING METHOD AND ELECTRONIC PART HAVING SILICA FILM
Document Type and Number:
Japanese Patent JP2006045352
Kind Code:
A
Abstract:
To provide a silica film-forming composition which is capable of forming a silica film having a low dielectric constant.
The silica film-forming composition contains (a) a siloxane resin obtained through hydrolytic condensation of a compound of formula (1): RnSiX4-n (wherein R is a group containing at least one atom chosen from B, N, Al, P, Si, Ge and Ti, a 1-20C organic group, H atom or F atom; X is a hydrolyzable group; and n is an integer of 0-2, provided that when n=2, multiple R's are identical to or different from each other, and when n is 0-2, multiple X's are identical to or different from each other), (b) a solvent that can dissolve component (a), (c) a solid particle having a void and (d) a quaternary onium salt.
Inventors:
ABE KOICHI
SAKURAI HARUAKI
SAKURAI HARUAKI
Application Number:
JP2004228554A
Publication Date:
February 16, 2006
Filing Date:
August 04, 2004
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09D183/04; C09D7/12; C09D183/02; H01L21/312; H01L21/316; H05K3/46
Domestic Patent References:
JP2003041191A | 2003-02-13 | |||
JPH05286785A | 1993-11-02 | |||
JP2000269204A | 2000-09-29 | |||
JP2002093796A | 2002-03-29 | |||
JP2003257963A | 2003-09-12 |
Foreign References:
WO2003066750A1 | 2003-08-14 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Ryugo Akahori
Shiro Terasaki
Ryugo Akahori