Title:
シリカ粒子分散液、研磨組成物及びシリカ粒子分散液の製造方法
Document Type and Number:
Japanese Patent JP7213234
Kind Code:
B2
Abstract:
A polishing composition that can not only achieve high polishing speed, but also can improve the surface smoothness (surface quality) of a polished substrate and reduce defects is provided. That is, provided is a polishing composition comprising silica particles and a water soluble polymer, wherein the contained silica particles satisfy the following requirements (a) to (c): (a) the primary particle diameter based on the specific surface area is 5 to 300 nm; (b) the coefficient of variation in the particle diameter is 10% or less; and (c) the Sears number Y is 10.0 to 12.0.
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Inventors:
Miki Egami
Mitsuaki Kumazawa
Ryo Muraguchi
Toshiro Komatsu
Mitsuaki Kumazawa
Ryo Muraguchi
Toshiro Komatsu
Application Number:
JP2020511001A
Publication Date:
January 26, 2023
Filing Date:
March 28, 2019
Export Citation:
Assignee:
JGC Catalysts Co., Ltd.
International Classes:
C09K3/14; B24B37/00; C01B33/141; C09G1/02
Domestic Patent References:
| JP201422511A | ||||
| JP2014140056A | ||||
| JP2012518127A | ||||
| JP201028078A | ||||
| JP200560219A |
Foreign References:
| WO2014007063A1 | ||||
| WO2017200297A1 |
Attorney, Agent or Firm:
▲高▼津 一也
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