Title:
シリコーン系粘着剤及び粘着テープ
Document Type and Number:
Japanese Patent JP7427552
Kind Code:
B2
Abstract:
A provided adhesive is a silicone-based adhesive having an initial adhesive force of 0.2 to 3 N/20 mm and having an adhesive force of 4 N/20 mm or less after heating at 260°C for 30 minutes. A provided adhesive tape includes a cured layer of the above silicone-based adhesive. The adhesive tape may further include a substrate, and the cured layer may be provided on a surface of the substrate. The adhesive tape shows high adhesion performance and is capable of achieving low thermal dependence. The adhesive is capable of forming the adhesive tape.
Inventors:
Yoshinobu Watanabe
Izumi Shimizu
Izumi Shimizu
Application Number:
JP2020119317A
Publication Date:
February 05, 2024
Filing Date:
July 10, 2020
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J183/04; C09J7/38
Domestic Patent References:
| JP2012149192A | ||||
| JP202050865A | ||||
| JP10147760A | ||||
| JP2012224804A | ||||
| JP2007180383A |
Foreign References:
| WO2017098919A1 | ||||
| WO2012086554A1 | ||||
| WO2012086553A1 | ||||
| WO2018101090A1 |
Attorney, Agent or Firm:
Koichi Kamada