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Patent Searching and Data


Title:
SILICONE RESIN COMPOSITION AND SILICONE RESIN MOLDED FORM
Document Type and Number:
Japanese Patent JP2004123936
Kind Code:
A
Abstract:

To provide a silicone resin composition having low water absorption and high dimensional stability and moldability, and to provide a silicone resin molded form having high heat resistance and visible light transmittance enough to be alternative to glass.

The silicone resin composition comprises a silicone resin, an alicyclic unsaturated compound of general formula(a)( wherein, Z is a group of formula(a1) or (a2); and R is H or methyl ) and another unsaturated compound each copolymerizable with the silicone resin in the weight ratio of (5-80):(10-50):(0-80), wherein the silicone resin is such that a triorganosilyl group represented by Si(CH3)2-X( wherein, X is R1-OCO-CR2=CH2, R1-CR2=CH2 or CH=CH2; R1 is an alkylene, alkylidene or phenylene group; and R2 is H or an alkyl ) is bound to the siloxy group of a polyorganosilsesquioxane having cage structure. The silicone resin molded form consists of a copolymer obtained from the composition.


Inventors:
ISOZAKI MASAYOSHI
ANDO HIDEKI
TERAMOTO TAKEO
Application Number:
JP2002291039A
Publication Date:
April 22, 2004
Filing Date:
October 03, 2002
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO
International Classes:
C08J5/00; C08F290/06; C08G77/20; (IPC1-7): C08F290/06; C08G77/20; C08J5/00
Attorney, Agent or Firm:
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano