To provide silvered copper powder with a silvered layer of high uniformity deposited thereon directly through the silvering treatment without a step of removing hydrophobic substance deposited on copper powder.
Silver is coated on the surface of copper particles through the substitution reaction between silver ions and metal copper in an organic solvent containing solution with silver ions being present therein, or in an emulsion consisting of an organic solvent phase and an aqueous solvent phase with silver ions being present therein. Silver nitrate is favorably used for a silver ion source, and one or more of alcohol, ketone, aldehyde, and ether having solubility to silver salt such as silver nitrate can be used for an organic solvent. Silvered flake-like copper powder having a silvered layer of high uniformity representing the lightness L* of ≥ 50 can be obtained, which is suitable for filler for conductive paste.
YAMASHINA HIROYUKI
HARANO JUNJI
| JP2002245849A | 2002-08-30 | |||
| JPH01119602A | 1989-05-11 | |||
| JPS53134759A | 1978-11-24 | |||
| JP2004510885A | 2004-04-08 | |||
| JP2004068111A | 2004-03-04 | |||
| JP2004052044A | 2004-02-19 |
Kenji Wada
Next Patent: SPUTTERING TARGET MANUFACTURING METHOD