Title:
枚葉式基板研磨装置
Document Type and Number:
Japanese Patent JP5004059
Kind Code:
B2
Abstract:
Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.
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Inventors:
Choi Jung Pong
Cheki horn
Kuguyou
Jo Jungun
Yong Changro
Song Du Hyun
Kusefun
Cheki horn
Kuguyou
Jo Jungun
Yong Changro
Song Du Hyun
Kusefun
Application Number:
JP2008295492A
Publication Date:
August 22, 2012
Filing Date:
November 19, 2008
Export Citation:
Assignee:
SEMES CO., Ltd
International Classes:
B24B41/06; B24B37/30; H01L21/304; H01L21/683
Domestic Patent References:
| JP10303110A | ||||
| JP2002208560A | ||||
| JP61038863A | ||||
| JP2000294622A | ||||
| JP6289625A | ||||
| JP11054394A |
Foreign References:
| WO2008048518A1 |
Attorney, Agent or Firm:
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Kyohei Tokioka
Yoshishige Takeo
Takeshi Sakaguchi
Kyohei Tokioka