Title:
SINTERED BODY FOR BOARD MANUFACTURE, BOARD, AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3442895
Kind Code:
B2
Abstract:
PURPOSE: To provide a sintered body for board manufacture, which is good in the positional accuracy of vias and can increase the mass production of boards, and boards obtainable from this sintered body.
CONSTITUTION: Columnar unfired bodies 22, which are respectively buried in the interiors of metallic wire materials 10 consisting of a metal having a melting point higher than the firing temperature of a sintered body in parallel to the axial lines of the wire materials 10, are molded, the bodies 22 are subjected to firing at a temperature higher than the melting point, flow-point or softening point of an insulating base body of the sintered body to form into a sintered body and thereafter, the sintered body is cut in a necessary thickness from the direction vertical to its axial line to manufacture boards.
Inventors:
Michio Horiuchi
Yukiharu Takeuchi
Youichi Harayama
Yukiharu Takeuchi
Youichi Harayama
Application Number:
JP3349995A
Publication Date:
September 02, 2003
Filing Date:
February 22, 1995
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
C04B35/00; H01L21/48; H01L23/12; H01L23/15; H01L23/498; H05K1/03; H05K3/00; H05K3/40; (IPC1-7): H01L23/15; C04B35/495; H01L23/12; H05K1/03; H05K3/00; H05K3/40
Domestic Patent References:
| JP5987893A | ||||
| JP62139345A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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