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Title:
SLAB CUTTING EQUIPMENT BY LASER BEAM HEATING
Document Type and Number:
Japanese Patent JP3394334
Kind Code:
B2
Abstract:

PURPOSE: To efficiently cut a work using a laser beam oscillator of relatively small output, to realize the cutting of the material of contour shape combined with the line and the arc in cutting the slab, and to provide the perpendicularlity in the thickness direction.
CONSTITUTION: A slab cutting equipment is provided with a work W and a cutting head part 3 which are controlled in the relative movement on the plane formed by X-axis and Y-axis which are orthogonal to each other, the Z-axis 5 to drive and control the cutting head part 3 which is perpendicularly fitted to the plane in the Z-axis direction, the C-axis to rotate and control the cutting head part 3 in the C-axis direction around this Z-axis 5, and a control device 15 to control these axes. A gas nozzle 17 for cutting and a laser beam irradiating head 19 which are positioned in the Z-axis direction are provided on the laser beam cutting head part 3, and an emitting nozzle 27 to emit the laser beam LB collected by the laser beam irradiating head 19 on the line in the same direction as the cutting advancing direction at the arbitrary angle diagonal to the ejecting direction of the gas nozzle 17 for cutting is provided.


Inventors:
Takeji Arai
Yasumasa Doi
Application Number:
JP22493794A
Publication Date:
April 07, 2003
Filing Date:
September 20, 1994
Export Citation:
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Assignee:
Amada Co., Ltd.
International Classes:
B23K7/00; B23K7/08; B23K7/10; B23K26/00; B23K26/046; B23K26/08; B23K26/38; (IPC1-7): B23K26/00; B23K7/08; B23K26/04; B23K26/08
Domestic Patent References:
JP1202387A
Other References:
【文献】国際公開93/9909(WO,A1)
Attorney, Agent or Firm:
Hidekazu Miyoshi (7 outside)