Title:
SLIT PROCESSING METHOD OF RESIN FILM
Document Type and Number:
Japanese Patent JP2014200875
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a slit processing method of a resin film in which, to a resin film comprising a soft resin layer and cover films on both surfaces too, oozing of the resin layer through a resin film edge part after slit processing can be suppressed and a storage period can be extended.SOLUTION: A slit processing method of a resin film comprising a resin layer and a first cover film and a second cover film laminated so as to sandwich the resin layer comprises a compressing process in which a place of slit planning of the resin film is compressed in the lamination direction from the first cover film side or the second cover film side so that the resin layer of the resin film is pushed into the place other than the place of slit planning, and a slit processing process in which the place of slit planning of the resin film is slit after the compressing process.
Inventors:
KIGUCHI KAZUYA
HAYASHI SHINTARO
HORIUCHI KOHEI
NUMAGUCHI YASUSHI
SHIMAMURA MITSUYOSHI
HAYASHI SHINTARO
HORIUCHI KOHEI
NUMAGUCHI YASUSHI
SHIMAMURA MITSUYOSHI
Application Number:
JP2013077681A
Publication Date:
October 27, 2014
Filing Date:
April 03, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B26D3/00
Domestic Patent References:
| JP2013035122A | 2013-02-21 | |||
| JP2003025280A | 2003-01-29 | |||
| JPS61100398A | 1986-05-19 |
Foreign References:
| WO2003083826A1 | 2003-10-09 |
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