Title:
SLURRY FOR CUTTING SILICON INGOT AND METHOD FOR CUTTING SILICON INGOT THEREWITH
Document Type and Number:
Japanese Patent JP2005112917
Kind Code:
A
Abstract:
To provide a slurry which is used for cutting silicon ingots and can reduce cutting resistance on the cutting of the silicon ingots to efficiently obtain wafers having high qualities, and to provide a method for cutting a silicon ingot therewith.
This slurry which is used for cutting the silicon ingots and contains abrasive grains is characterized by furthermore containing nitric acid and hydrofluoric acid in a mass ratio of the nitric acid to the hydrofluoric acid of 0.5 to 25 : 1. The slurry may further contain acetic acid. The slurry is preferably used at 40 to 110°C.
Inventors:
TSURUTA AKIZO
HAMAYASU MASAYUKI
KAWASAKI TAKAFUMI
NISHIDA HIROICHI
TOMINAGA HISAFUMI
HAMAYASU MASAYUKI
KAWASAKI TAKAFUMI
NISHIDA HIROICHI
TOMINAGA HISAFUMI
Application Number:
JP2003345919A
Publication Date:
April 28, 2005
Filing Date:
October 03, 2003
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B24B57/02; B28D5/04; C10M103/00; C10M105/24; C10M125/02; C10M125/10; C10M125/18; C10M125/20; C10M125/26; C10M129/32; C10M173/02; C10N30/06; C10N40/22; C10N70/00; C10N80/00; (IPC1-7): C10M173/02; B24B57/02; B28D5/04; C10M103/00; C10M105/24; C10M125/02; C10M125/10; C10M125/18; C10M125/20; C10M125/26; C10M129/32
Attorney, Agent or Firm:
Michiteru Soga
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
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