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Patent Searching and Data


Title:
SMALL-SIZED ELECTRONIC COMPONENT AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2000261002
Kind Code:
A
Abstract:

To surely connect a part between a function part and the outside, and seal a closed space.

An upper substrate 1 and a lower substrate 3 are face-bonded to the surface and the rear of a silicon substrate 2, respectively. An angular velocity detecting part 12 is accommodated in a closed space 4. An electrode 19 for detection, which faces the detecting part 12, is formed on the surface of the lower substrate 3. A lead part 19A of the electrode 19 is pinched by the lower substrate 3 and an electrode pinching part 18 of the silicon substrate 2. A ventilation line interconnected with the closed space 4 is formed in the vicinity of the side surface of the lead part 19A. The ventilation line is interconnected with an interconnection hole 22 which opens to the lower substrate 3. A gas in the closed space 4 is discharged through the ventilation line and the interconnection hole 22. A conducting film 23 is formed in the interconnection hole 22 and is electrically connected with the electrode 19 for detection, and the ventilation line can be sealed.


Inventors:
ATSUJI KENICHI
Application Number:
JP5940299A
Publication Date:
September 22, 2000
Filing Date:
March 05, 1999
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
G01P3/42; G01C19/56; G01C19/5755; G01C19/5769; G01P15/125; H01L29/84; (IPC1-7): H01L29/84; G01C19/56; G01P3/42; G01P9/04; G01P15/125
Attorney, Agent or Firm:
Kazuhiko Hirose