To provide a socket testing method and a socket testing tool for testing an IC package by mounting the IC package having grid-shaped terminals at the lower surface of a package body, capable of easily testing the location of terminals of a socket, and capable of confirming actual contacting state of the terminals of the socket with the terminals of the IC package.

A testing tool comprising a transparent base 101 having the same shape with a package main body of the IC package, and terminals 103 same with the terminals of IC packages arranged to the lower surface of the base 101 are used.