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Title:
SOFT PACKAGING MATERIAL PROCESSING APPARATUS, PERFORATION PART FORMING PROCESSING APPARATUS TO SOFT PACKAGING MATERIAL, AND PACKAGE
Document Type and Number:
Japanese Patent JP2002067188
Kind Code:
A
Abstract:

To provide a soft packaging material processing apparatus capable of flexibly applying good perforation processing or punching processing, which prevents such a phenomenon that the soft packaging material is ruptured at an arbitrary position in an arbitrary shape by mistake at the time of the packaging work to an object to be packaged, at a low cost, and a package comprising the soft packaging material processed by the soft packaging material processing apparatus.

The laser processing device L arranged to the housing S1 of a slitter S irradiates the soft packaging material F with the laser beam C emitted from a laser oscillator L1 while scanning the soft packaging material F in an XY direction by a scanner L2 to apply perforation processing or punching processing to the soft packaging material F.


Inventors:
MATSUI TAKAYOSHI
Application Number:
JP2000256806A
Publication Date:
March 05, 2002
Filing Date:
August 28, 2000
Export Citation:
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Assignee:
DAISAN SHIGYO KK
International Classes:
B65D71/08; B23K26/08; B23K26/382; B31B1/14; B31B70/14; B65D65/28; B65D75/62; B23K101/16; (IPC1-7): B31B1/14; B23K26/00; B23K26/08; B65D65/28; B65D71/08; B65D75/62
Attorney, Agent or Firm:
Naoko Hisashi