SOFTENING RESISTANT COPPER ALLOY HAVING HIGH CONDUCTIVITY

Title:

SOFTENING RESISTANT COPPER ALLOY HAVING HIGH CONDUCTIVITY

Document Type and Number:

Japanese Patent JPS59232244

Kind Code:

A

Abstract:

PURPOSE: To obtain a Cu alloy having considerably improved softening resistance while ensuring electric conductivity by adding specified amounts of Fe, Mg and P to Cu.

CONSTITUTION: This Cu alloy consists of, by weight, 0.01W0.09% Fe, 0.05W0.2% Mg, 0.02W0.1% P and the balance Cu. The Cu alloy has superior softening resistance after heating and high conductivity, so it is suitable for use as a lead material for a semiconductor apparatus, a material for electric parts requiring high reliability such as a terminal, a swith and a terminal clip, and a material for a heat exchanger.

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Inventors:

YAMAZAKI SHIYUUICHI
YAMAGUCHI HIROSHI
TANIGUCHI YOUSUKE

Application Number:

JP10664783A

Publication Date:

December 27, 1984

Filing Date:

June 16, 1983

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO

International Classes:

C22C9/00; (IPC1-7): C22C9/00

Attorney, Agent or Firm:

Jyohei Yamashita

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Next Patent: SINGLE CRYSTAL SUPERALLOY PRODUCT AND HEAT TREATMENT THEREFOR