Title:
SOLDER ARRANGING NOZZLE ASSEMBLY WITH INERT COVERING GAS AND INERT BLEED-GAS
Document Type and Number:
Japanese Patent JPH04246888
Kind Code:
A
Abstract:
PURPOSE: To lower the deterioration rate and amount of a soldering iron coating metal, and the deterioration rate of an assembled housing material and flux filled in solder by feeding a low temperature inert breed gas to the heated metal tip of a soldering iron. CONSTITUTION: A nozzle fixing part 15 is provided with a port 14 communicating with an inner hole 17 and a breed gas supply and then a breed gas is supplied in order to cool a nozzle assembly while preventing oxygen in the ambient air from intruding into the assembly. The nozzle assembly 11 comprises a nozzle head 27 having a tubular inner hole 29 which is bonded to a tapered inner hole 31 on the underside. The inner hole 31 has a solder supply orifice 33 coupled with an inner passage 35 communicating with a solid solder supply through the body 37 of the nozzle head 27. A solder being fed through the solder supply orifice 33 is fused by the heated metal tip 23 of soldering iron to form a small mass of solder.
Inventors:
TERII EFU HEIDON
KURISUTOFUAA EI HITSUKUSU
PIITAA JII RIIDAAMAN
ARUBUIN DEII GUEN
SUTEIIBUN SHII SHIYUTAINBATSUH
SUTANRII KEI YU
KURISUTOFUAA EI HITSUKUSU
PIITAA JII RIIDAAMAN
ARUBUIN DEII GUEN
SUTEIIBUN SHII SHIYUTAINBATSUH
SUTANRII KEI YU
Application Number:
JP22972991A
Publication Date:
September 02, 1992
Filing Date:
August 16, 1991
Export Citation:
Assignee:
IBM
International Classes:
B23K3/06; H01L21/60; H05K3/34; B05B1/24; (IPC1-7): B05B1/24; H01L21/60; H05K3/34
Attorney, Agent or Firm:
Hiroshi Sakaguchi (2 outside)