Title:
SOLDERING STRUCTURE FOR LEAD MEMBER TO CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2023068517
Kind Code:
A
Abstract:
To provide a soldering structure for a lead member to a circuit board in which a fillet can be formed even on an opposite side of a thorough hole of the circuit board to which a soldering iron is abutted.SOLUTION: The present invention relates to a soldering structure for electrically connecting a circuit board 10 including a through hole 10a with a lead member 20 passing from the outside to the inside of a housing (enclosure) 2 in which the circuit board is stored. The circuit board includes: a first land part 12 disposed at a peripheral edge of an opening of the through hole on one side face in a front face and a rear face of the circuit board; a second land part 13 disposed at a peripheral edge of the opening of the through hole on the other side face; and a cylindrical land part 14 disposed on an inner peripheral wall of the through hole and connecting the first land part and the second land part. The lead member includes: a first lead part 23 passing the inside of the cylindrical land part; and a second lead part 22 which is bent with respect to the first lead part, disposed along the second land part and soldered in contact with the second land part.SELECTED DRAWING: Figure 4
Inventors:
DENDO KIYOSHI
TAKAYAMA YASUO
KONAGAYA YASUAKI
TAKAYAMA YASUO
KONAGAYA YASUAKI
Application Number:
JP2021179697A
Publication Date:
May 17, 2023
Filing Date:
November 02, 2021
Export Citation:
Assignee:
NIDEC POWERTRAIN SYSTEMS CORP
International Classes:
H05K1/18; H05K3/34; H05K7/12; H05K7/14
Attorney, Agent or Firm:
Shinji Komai
Ryoichi Yamashita
Ryoichi Yamashita
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