Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023068518
Kind Code:
A
Abstract:
To reduce the size of a semiconductor device.SOLUTION: A semiconductor device 1 includes die pads 5 and 6, semiconductor chips 2 and 3, and an insulator part 28 for sealing these. The semiconductor chip 2 includes a source electrode 2S formed on a front surface side, and a drain electrode 2D formed on a back surface side. The drain electrode 2D is mounted on the die pad 5 so as to face the die pad 5. The semiconductor chip 3 includes a source electrode 3S formed on a front surface side and a drain electrode 3D formed on a back surface side. The source electrode 3S is mounted on the die pad 6 so as to face the die pad 6. In the insulator part 28, a wire 26DS for electrically connecting the source electrode 2S of the semiconductor chip 2 and the drain electrode 3D of the semiconductor chip 3 is formed.SELECTED DRAWING: Figure 8
Inventors:
SUZUKI TAKASHI
Application Number:
JP2021179698A
Publication Date:
May 17, 2023
Filing Date:
November 02, 2021
Export Citation:
Assignee:
AOI ELECTRONICS CO LTD
International Classes:
H01L25/07
Attorney, Agent or Firm:
Patent Attorney Tsutsui International Patent Office
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