Title:
SOLDER JOINT STRUCTURE, POWER MODULE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, METHOD FOR MANUFACTURING SOLDER JOINT STRUCTURE, METHOD FOR MANUFACTURING POWER MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
Document Type and Number:
Japanese Patent JP2013202648
Kind Code:
A
Abstract:
To provide a solder joint structure capable of preventing a steel member change by a soldering material and reliably soldering a steel member and a joined material when soldering a copper member composed of copper and copper alloy.
A solder joint structure 40, which is fabricated by joining a copper member 13 composed of copper or copper alloy and a joined material 21 with a soldering material, includes a glass layer 41 formed on a surface of the copper member 13, an Ag layer 42 laminated on a glass layer 41, and a solder layer 43 laminated on the Ag layer 42. Crystalline oxide particles 44 are dispersed in the Ag layer 42.
Inventors:
NISHIMOTO SHUJI
NAGATOMO YOSHIYUKI
NAGATOMO YOSHIYUKI
Application Number:
JP2012073690A
Publication Date:
October 07, 2013
Filing Date:
March 28, 2012
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K1/19; B23K1/00; B23K1/20; H01L23/36; H01L25/07; H01L25/18; H05K7/20; B23K101/40; B23K103/12
Domestic Patent References:
| JP2010287869A | 2010-12-24 | |||
| JP2010238965A | 2010-10-21 |
Foreign References:
| WO2011058062A1 | 2011-05-19 | |||
| US20110135956A1 | 2011-06-09 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa
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