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Title:
SOLDER PASTE AND CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014144465
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a solder paste in which a large amount of Zn particles are added to a solder paste containing Sn-Bi-based solder alloy particles without substantially increasing a melting point of the solder alloy, and substantially oxidizing the Zn particles.SOLUTION: A solder paste contains powder of an Sn-Bi-based solder alloy, Zn particles covered with an oxide film of a first metal element excluding Sn and Bi, and a flux. The first metal element has higher affinity with oxygen than with Zn.

Inventors:
OKAMOTO KEISHIRO
SHIMIZU KOZO
SAKUYAMA SEIKI
Application Number:
JP2013013520A
Publication Date:
August 14, 2014
Filing Date:
January 28, 2013
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B23K35/22; B22F1/00; B22F1/02; B22F9/08; B23K1/00; B23K35/26; B23K35/28; C22C12/00; C22C18/00; H01L21/60; H05K3/34; B23K101/42
Domestic Patent References:
JP2003290974A2003-10-14
JP2011161495A2011-08-25
JP2003112285A2003-04-15
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Yamaguchi Akinori



 
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