Title:
SOLDER PASTE AND FLUX
Document Type and Number:
Japanese Patent JP2011136365
Kind Code:
A
Abstract:
To provide solder paste and flux suppressing slump-in-heat in a reflow soldering method.
Solder paste contains solder powder and flux containing resin component, solvent component, activator, thixotropic agent and additive. The additive contains the slump-in-heat inhibiting component expressed in formula (1) (where, R10 denotes an aliphatic hydrocarbon group having 14 or more carbon atoms, and R11 denotes a hydrocarbon group) or in formula (2) (where, R12 denotes a hydrocarbon group, R13 denotes a hydrocarbon group, and R20 denotes an aliphatic hydrocarbon group having 14 or more carbon atoms).
Inventors:
SHIBATA SEIJI
KASAHARA TOMOHIKO
NAKAJI MASAKAZU
HARA TAKUO
KASAHARA TOMOHIKO
NAKAJI MASAKAZU
HARA TAKUO
Application Number:
JP2009299274A
Publication Date:
July 14, 2011
Filing Date:
December 29, 2009
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363; B23K3/06; H05K3/34; B23K35/26; B23K101/42; C22C13/00
Domestic Patent References:
| JP2003347718A | 2003-12-05 | |||
| JP2006007300A | 2006-01-12 | |||
| JPH07144292A | 1995-06-06 | |||
| JP2002263884A | 2002-09-17 |
Attorney, Agent or Firm:
Masatomo Sugiura