To provide a solder selecting program, with which a best suitable solder for a base material to be welded can be positively selected, and a method therefor.
In this solder selecting program, the degree of lattice mismatch is calculated on the basis of the inter-stable site distance in the welding surface of the base material, and the solid face inter-atomic distance just below the melting point of the base metal or an added metal. When both values of the degree of lattice mismatch of the base metal and the added metal for soldering are smaller than predetermined values, the degree of plane mismatch is calculated on the basis of the inter-atomic distance in the solid face low index face nearest to the fluid face of the added metal, the inter-atomic distance in the solid face low index face nearest to the fluid face of the base metal, and an angle formed by a highest density direction between the added metal and the base metal. When the value of the degree of plane mismatch is larger than a predetermined value, the value of the base metal and the added metal for soldering is accumulated by storing means, a combination of the base metal and added metal having the degree of lattice mismatch of value as small as possible and the degree of plane mismatch of value as large as possible is selected from a data accumulated by the storing means.
YAMAZAKI YOSHIHISA
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
Shuichi Kitamura
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