Title:
SOLDER STATE OUTPUT UNIT AND SOLDER INSPECTING SYSTEM USING THE UNIT
Document Type and Number:
Japanese Patent JP3279121
Kind Code:
B2
Abstract:
PURPOSE: To provide a solder state output unit and a solder inspecting system which uses the unit in which the quality deterioration of a soldered site can be prevented and the quality control can be efficiency executed.
CONSTITUTION: A light is emitted to a board 17 to be inspected by a light emitting unit 1, inspection data such as solder amount to indicate the state of a soldered site on the board 17 is calculated based on a color image signal obtained by imaging the reflected optical image by an imaging unit 2, and the data is sent to a judgement division 8 and a data processor 12. The propriety of the site is discriminated at each board 17 to be inspected based on the data by the judgement division 8, the time information of the data such as the solder amount to indicate the time transition of the quality of the site is formed by using the data of the board 17 in the processor 12, and the time transition information is displayed on a display unit 10.
Inventors:
Masato Ishiba
Application Number:
JP8771195A
Publication Date:
April 30, 2002
Filing Date:
March 22, 1995
Export Citation:
Assignee:
Omron Corporation
International Classes:
G01B11/24; (IPC1-7): G01B11/24
Domestic Patent References:
| JP727710A | ||||
| JP5296746A | ||||
| JP6242016A |
Attorney, Agent or Firm:
Teruo Aoki