To provide a soldering device which can suppress the adhesion of solder and a solder oxide film to a substrate holding member which is used for transporting a circuit board and a material coated section used for the device.

The wave soldering device 1 has first and second containers 2 and 3. The first container 2 is provided with a transportation conveyor 5 which transports the circuit board 4 and a spray type flux coater 6 which applies flux 7 for board to the circuit board 4. The second container 3 is provided with a material coater 10 which applies flux 11 for transportation pawl to the transportation pawls 9 of the conveyor 8, a preheater 21, a solder bath 22 storing the solder used for soldering the circuit board 4, and a cooling fan 23 used for cooling the board 4.