PURPOSE: To solder parts to be soldered surely under specified conditions at all times without the influence in the variation of said parts by heating the parts to be soldered which are held in abutment on wire solder by means of a movable arm with a soldering guide, soldering said parts and detecting the supply and melting of the solder.
CONSTITUTION: When parts 1 to be soldered are supplied to a prescribed position, an electrode holder pair 19 moves vertically to bring an electrode pair 20 into abutment on the top and bottom ends of terminal pins 5 (5a or 5b) and electricity is conducted to the electrodes from a resistance heating type power source 22, by which the pins 5 are heated. At this time, a movable arm 8 is turned counterclockwise by a piston rod 15 until the arm abuts on a stopper pin 16. When the pins 5 begin to be heated, the rod 15 is retracted, the arm 8 is turned clockwise by a spring 13 and the wire solder 12 projecting to a specified length from the preceding end of a solder guide pipe 10 stops by abutting on the part of the pins 5 wound with the lead wires 4. When the solder 12 melts, the above-described conduction of electricity is stopped, and the arm 8 turns further until it abuts on the rod 15, then the arm stops and a slit plate 17 shields light, by which a switch 18 is turned on and the completion of the soldering is detected.
SATOU KATSUAKI
WADA HIROSHI
