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Title:
SOLDERING METHOD AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JPS53122650
Kind Code:
A
Abstract:

PURPOSE: To provide the subject method and device wherein the flow direction of injected molten solder is defined so that the molten solder flows only in a direction opposite to the shifting direction of a print plate, and the print plate is tilted at a preselected angle relative to the injected surface to carry out soldering, whereby exceellent soldering can be achieved.


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Inventors:
SHIGENO TOORU
KURODA TOORU
KAMIYAMA TAKUROU
Application Number:
JP3787677A
Publication Date:
October 26, 1978
Filing Date:
April 01, 1977
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K1/08; H05K3/34; (IPC1-7): B23K1/08; H05K3/34
Domestic Patent References:
JP41016367A
JPS5051450A1975-05-08



 
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