はんだ付け方法およびはんだ付け装置

Title:

はんだ付け方法およびはんだ付け装置

Document Type and Number:

Japanese Patent JP4241979

Kind Code:

B2

More Like This:

WO/2011/080990	SOLDER PASTE AND FLUX
JP5530162	Batch brazing method in diffusion furnace
JP6304808	Soldering iron and electronic equipment manufacturing equipment using it

Inventors:

Hiroshi Takahira
Tsuneo Hamaguchi
Kenichi Takahashi

Application Number:

JP35738598A

Publication Date:

March 18, 2009

Filing Date:

December 16, 1998

Export Citation:

Assignee:

Optrex Co., Ltd.
Mitsubishi Electric Corporation
Nippon Seiki Co., Ltd.

International Classes:

B23K1/00; H05K3/34; B23K1/008; H05K13/02

Domestic Patent References:

Attorney, Agent or Firm:

Shunsuke Nakao
Takashi Ito
Shingo Sagawa

Previous Patent: 歯科用光重合性組成物

Next Patent: 内視鏡の先端部及び先端部への指標形成方法