PURPOSE: To obtain a photosensitive composition having high sensitivity, high resolution and superior adhesion to a substrate, developable with a dil. aqueous alkali soln. after exposure and giving a photoset film having superior electrical and mechanical characteristics and superior characteristics as a solder resist by mixing a prescribed photopolymerizable compound with a prescribed amount each of specified compound.
CONSTITUTION: This solid photosensitive resin composition contains 30W70wt% photopolymerizable compound (A) having at least one terminal ethylenic unsatd. double bond, 0.001W15wt% photopolymn. initiator (B), 30W70wt% copolymer (C) consisting of 1W25wt% α,β-ethylenic unsatd. carboxylic acid, 5W20wt% monoolefinic unsatd. compound and 55W94wt% β-ethylenic unsatd. carboxylic ester and 0.05W40wt% at least one kind of compound (D) selected among a compound (a) having at least one epoxy ring, a compound (b) contg. nitrogen, a tackifier (c) and aromatic, aliphatic or alicyclic petroleum resin (d). The photosensitive resin composition is used as a photoresist.
FUKUHARA SEIJI
NISHIWAKI KOICHI
IKEDA HIROHARU
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