To provide a solid-state image pick-up device that is capable of preventing a decline in the amount of light entering a photo diode, and in which difficulty level of processing is low, and an increase in the number of processing steps is suppressed.

The solid-state image pick-up device according to the present invention comprises: a semiconductor substrate 101; a photoreceptor 102 that is formed on the semiconductor substrate 101 and photoelectrically converts incident light; and a plurality of wiring layers laminated on the surface where the photoreceptor 102 on the semiconductor substrate 101 is formed. One or more of the plurality of wiring layers comprise: a first insulating layer 104; metal wirings 105 formed on the first insulating layer 104; a reflection prevention layer 122 that is laminated on the first insulating layer 104 and metal wirings 105 to prevent the diffusion of the material that constitutes the metal wirings 105 and prevent the reflection of incident light; and a second insulating layer 108 laminated on the reflection prevention layer 122.