Title:
SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3827909
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which can eliminate noise in a picked up image caused by an unwanted incident light and can meet requirements of future miniaturization of pixels.
SOLUTION: 1st-3rd embedded metal layers 5, 8 and 11, which surround a light-receiving part 3 on a P-type semiconductor substrate 1 three- dimensionally in a fence shape, are embedded continuously in grooves of 1st-3rd insulating films 4, 7 and 10. The whole outside of the top part of the 3rd embedded metal layer 11 is covered with a light shielding 3rd layer metal 12. The 1st-3rd embedded metal layers 5, 8 and 11 are composed of single layer films of Cu.W.TiW or composite films of Cu.W.TiW and TiN.TiW.Ti. The 3rd layer metal 12 is composed of a single layer film of Al.Al-Si.A1-Cu.Cu.W or a composite film of Al.Al-Si.Al-Cu.Cu.W and W.TiN.TiW.Ti and are formed simultaneously, when wiring metal films of a transistor are formed so as not to be connected electrically to the wiring metal films.
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Inventors:
Takayuki Kawasaki
Application Number:
JP2000078028A
Publication Date:
September 27, 2006
Filing Date:
March 21, 2000
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L27/14; H01L27/146; H04N5/335; H04N5/357; H04N5/369; H04N5/374; (IPC1-7): H01L27/14; H01L27/146; H04N5/335
Domestic Patent References:
| JP4354161A | ||||
| JP3044071A | ||||
| JP6232256A | ||||
| JP6112513A |
Attorney, Agent or Firm:
Aoyama Aoi
Hiroshi Yamazaki
Hiroshi Yamazaki