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Title:
官能化された電気導体または半導体表面を含む固体支持体、その調製方法及びその使用
Document Type and Number:
Japanese Patent JP4403459
Kind Code:
B2
Abstract:
The present invention provides a method for encapsulating biocompatible polymers. The method comprises using a solid support comprising at least one electrically conducting and/or semiconducting region containing a reducible oxide on its surface, wherein at least one zone of this surface is functionalized with an electrografted organic film obtained from electroactive organic precursors each comprising at least one functional group of interest, and wherein the number of functional groups of interest accessible for the formation of a covalent, ionic or hydrogen bond with a complementary group within said film represents at least 90% of the total number of functional organic groups of interest, and wherein the density of the accessible functional groups of interest is between 104/μm2 and 1010/μm2. The method further comprises attaching molecules of interest or objects bearing a complementary function to the solid support.

Inventors:
Bureau Christoph
Mauanda bridget
Amur summer
Charliere Juliennes
Palacin Serge
Application Number:
JP2004518831A
Publication Date:
January 27, 2010
Filing Date:
June 16, 2003
Export Citation:
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Assignee:
Comisaria Arenergy Atomique
International Classes:
C08F2/00; C08F2/58; C08F8/00; C08G85/00; C09D5/44
Domestic Patent References:
JP50015485B1
JP10146044A
JP2003192793A
JP2005525440A
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Kenji Saito



 
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